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Product Name Description big kinds 7 segment led display LED DOT MATRIX LED LAMP LAMP CLUSTER LIGHT BAR BARGRAPH LED STRIP LED LIGHTING LED SCREEN

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7 Making the digit flashing

LED Technical

Gerneral Information | Application note | ABSOLUTE MAXIMUM RATINGS | CHARACTERISTICS CURVES | LED part No system

GENERAL INFORMATION

 

HOW TO USE LED

·FORMING:

Please do not form the LED after soldering .If forming id necessary ,it must be done before soldering .
Any unsuitable stress applied to the epoxy may break bonding wires in LED.
·SOLDERING:

Soldering Bath ---260℃±5 ℃ within 5 seconds: Soldering Iron-Under 30W within 5 seconds.(1.6mm from epoxy body)
Do not apply any force of mechanical stress onto the leads or epoxy body during soldering heat is remained.
If soldering one line of LED on a P.C . board by using a soldering iron ,don t solder both the leads of the LED at same time .
·CLEANING:

Use Alcohol ,Freon TE or Chlorosen to clean LED at normal temperature for less than l minute .
Do not use unspecified chemical liquid because it may cause crack or haze on the epoxy body.
·PREVENTING OVER CURRENT :

In order to operate LED in stable condition , please put protective resistors in series.
Resistor value can be determined by the formula
R= WHERE:
Vs=Source Voltage
VF=Forward Voltage
If=Recommended Current of LED (10-20mA)
·BRIGHTNESS:

For the purpose of obtaining uniform brightness, LED shall be same current.
It is useful for uniform brightness if you use larger source voltage and protective resistor .

APPLICATION NOTES
Cleaning Avoid using any unspecified chemical solvent to clean LED . For example, Trichloroethylene, Chlorosen, Acetone, and Diflon S3MC. Any cleaning method can only be taken under normal temperature in one minute or less if it is required. Alcohol is the one recommended for cleaning.
Forming Any forming on lead pin must be done before soldering, not during or after soldering. Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire. While forming, please use a tie bar cut or equivalent to hold or bend the pin. 2mm from the base of resin is the minimum distance for the place bending the lead pin. Avoid bending the lead pin at the same point twice or more.
Soldering Pin hole pitch on PCB must match lead pin pitch so as not to cause any stress on lead wires. No stress can be applied to lead pins when they are heated, otherwise disconnection may occur. Three minutes are necessary for LED to cool down to normal room temperature.

TECHNICAL DATA

ABSOLUTE MAXIMUM RATINGS (TA=25oC)	If	Pd	Vr	IPF	TOPR	TSTG	TSOL
	mA	mW	V	mA	oC	oC	oC
H	25	60	5	150	-40 to +80	-40 to +85	Max.260±5℃ for 3 sec Max. (1.6mm from the base of the epoxy bulb)
E	25	60	5	150
Y	25	60	5	150
G	30	65	5	150
SR	25	60	5	150
LR	25	50	5	150
UR	25	60	5	150
UE	30	65	5	150
UY	30	65	5	150
UG	30	75	5	150
PG	30	110	5	150
BG	30	110	5	150
B	30	120	5	100
UB	30	120	5	100
UV	30	120	5	100
W	30	120	5	100
W	30	120	5	100

Parameter
Forward Current IF
Power Dissipation Pd
Reverse Voltage VR
Peak Forward Current IPF (Duty 1/10 @1KHZ)
Operation Temperature TOPR
Storage Temperature TSTG
Lead Soldering Temperature TSOL

CHARACTERISTICS CURVES